The Interchangeable kit has a modular structure. It consists of pressure plate (AP), moving plate (PAP) and probe plate (KTP) and socket protection plate (HSP).
KTP from CEM1
Incl. holder for internal CONTACT PIN interface (max. 6 interface blocks)
including wire protection plate
Product area: 330x180mm
External dimensions: 400x270mm
Plate material thickness: 10mm
PAP from EGS-AS
Incl. spring pads and 10 spacers
Product area: 330x180mm
External dimensions: 400x270mm
Plate material thickness: 5mm
AP made of ESD acrylic glass
Product area: 350x230mm
External dimensions: 407x240mm
Plate material thickness: 15mm
HSP made of acrylic glass
Incl. Mounting material
External dimensions: 370x250mm
Plate material thickness: 3mm
