The Interchangeable kit has a modular structure. It consists of pressure plate (AP), moving plate (PAP) and probe plate (KTP) and socket protection plate (HSP).
KTP from CEM1
Incl. holder for internal CONTACT PIN interface (max. 6 interface blocks)e)
Expandable to max. 12 interface blocks
Including wire protection plate
Product area: 520x250mm
External dimensions: 570x335mm
Plate material thickness: 10mm
PAP from EGS-AS
Incl. spring pads and 10 spacers
Product area: 520x250mm
External dimensions: 570x335mm
Plate material thickness: 5mm
AP made of ESD acrylic glass
Product area: 520x295mm
External dimensions: 576x330mm
Plate material thickness: 15mm
HSP made of PMMA, colorless
Incl. Mounting material
External dimensions: 543x316mm
Plate material thickness: 3mm
